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  1. Speedline Technologies - ACCEL, CAMALOT, MPM, and ELECTROVERT

    Speedline brands include: ACCEL, CAMALOT, MPM, and ELECTROVERT
    MPM1
    ACCEL1
    Semiconductor manufacturing1
    Dispensing systems1
    CAMALOT1
    Underfill1
    ELECTROVERT1
    Reflow oven1
    Wafer bumping1
    Stencil printers1
    MEMS manufacturing1
    Lead free wave solder1
    Speedline technologies1

    www.speedlinetech.com - 2009-02-05

  2. Premier Semiconductor: Wafer Probe, Burn-in, Lead Repair, IC Programming, Lead free, BGA Reballing Services

    Premier Semiconductor Services combines industry expertise with the highest quality standards in providing the most complete offering of backend services ...
    outsourced2
    Electrical Test1
    test services1
    wafer bumping1
    semiconductor testing1
    IC programming1
    IC testing1
    wafer probe1
    solderability1
    Electrical Characterization1
    Final Manufacturing1
    IC repair1
    Backend Services1
    IC Counterfeit detection1
    mark and demark1
    tape and reel services1
    bake & dry pack0
    BGA reballing & ball attach0
    burn-in services0
    fine & gross leak test0
    hot solder dip & restoration0
    IC Counterfeit test0
    IC ink mark0
    IC lead straightening0
    IC recovery from boards0
    IC Value Add Services0
    lead free & Pb conversion0
    Pb free conversion0
    Premier Semiconductor Services0
    solder conversions0
    solder rework0

    www.premiers2.com - 2009-02-08

  3. FlipChips Dot Com free micropackaging information

    A free, neutral source providing micropackaging tutorials,articles, abstracts, technology updates, photographs, newsletter, supplier directory
    CSP1
    MEMS1
    microelectronics1
    optoelectronics1
    flip chip1
    flipchip1
    conductive adhesives1
    underfill1
    chip scale package1
    wafer bumping1
    conductive adhesive1
    nano-optics1
    solder bumping1
    ball bumping1
    underfills1
    die bumping1
    die flipping1
    single chip flipchip1
    stud bumping1
    wafer-level packaging1
    bumped die1
    flipchips1
    flip chips1
    bumped wafers0
    chipscale package0
    flip chip abstracts0
    flip chip articles0
    flipchip articles0
    flip chip information0
    flipchip information0
    flip chip literature0

    www.flipchips.com - 2009-02-04

  4. Advanced MicroSensors: Magnetic Sensors,Thin Film Fabrication amd MEMS Foundry

    Advanced MicroSensors designs and produces thin film, AMR, GMR and inductive magnetic sensors for tape storage drives, and provides wafer fabrication and ...
    actuator1
    AMR1
    MEMS1
    thin film1
    photolithography1
    GMR1
    magnetic sensors1
    wafer bumping1
    vacuum technologies1
    MEMS fabrication1
    MEMS foundry1
    wet etching1
    micro sensors1
    IBE etching0
    MEMS switch0

    www.advancedmicrosensors.com - 2009-02-07

  5. SiPkg Home

    SiPkg Home
    SIP2
    flip chip1
    wafer bumping1

    www.sipkg.com - 2009-02-07

  6. Photo Stencil - Stencils, Pallets, Squeegee Blades, Screens, Repair Tools, Inspection Templates, Custom Designs, Electroforming

    Photo Stencil manufactures stencils, squeegee and wiper blades, SMT assembly and packaging tools, inspection templates and custom-designed parts. Uses ...
    laser cutting2
    stencil2
    electroforming1
    electropolish1
    post-processing1
    electroform1
    wafer bumping1
    laser-cut1
    electroformed1
    electroformed parts1
    step stencils1
    e-fab1
    electroform stencil1
    frameless stencils1
    SMT tooling1
    AMTX0
    AMTX E-Fab0
    c-fab0
    chem-etch stencil0
    chemically etched stencil0
    electroformed stencil0
    h-fab0
    hybrid stencil0
    laser-cut stencil0
    l-fab0
    metal glue reservoir0
    pcb printing tool0
    photostencil0
    photo stencil0
    photo-stencil0
    universal prototype stencil0

    www.photostencil.com - 2009-02-04

  7. Home of wafer level packaging folks

    Information about Wafer Level Packaging (WLP) technologies for all WLP folks. Just go through all the articles available here and post yours if you would.
    polymer2
    CSP1
    solder1
    DRAM1
    interconnection1
    sputtering1
    flip chip1
    redistribution1
    bumping1
    RDL1
    UBM1
    WLP1
    wafer bumping1
    solder flux1
    Wafer level packaging1
    electromigration1
    solder joint1
    solder bumping1
    solder bump1
    Wafer level package1
    solder joint reliability1
    polymer dielectric0
    polymer passivation0
    solder ball mounting0
    under bump metalurgy0

    www.semitechnik.com - 2009-02-06

  8. Syagrus Systems LLC - Automated Wafer Backgrind, Automated Wafer Dicing, Automated and Manual Die Visual Inspection, Automated and Manual Die Sort

    Syagrus Systems LLC provides wafer grinding, dicing, inspection, and packaging services to the semiconductor insdustry
    packaging3
    silicon wafer1
    dicing1
    wafer processing1
    carrier tape1
    wafer handling1
    wafer dicing1
    wafer slicing1
    wafer fab1
    wafer fabrication1
    wafer bumping1
    semiconductor wafer1
    dry packaging1
    wafer probe1
    wafer prober1
    wafer test1
    die sort1
    wafer cutting1
    wafer backgrinding1
    thin wafer1
    semiconductor wafer processing1
    wafer sawing1
    wafer dicing tape1
    bare die processing0
    bumped die processing0
    bumped wafer processing0
    bump wafer inspection0
    component bake0
    dicing technology0
    die visual inspection0
    polishing single wafer0

    www.syagrussystems.com - 2009-02-08

  9. International Micro Industries, Inc.

    International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision ...
    Gold4
    TAB2
    Electroplating1
    FlipChip1
    UBM1
    WLP1
    Wafer Bumping1
    Known Good Die1
    Copper electroplating1
    Solder Bumping1
    Thick Photoresist1
    Advanced Chip Packaging0
    Au Bumping0
    Bare Die Packaging0
    Copper Pillar Bumps0
    Fine Pitch Bumps0
    Flip Chip Packaging0
    Gold Bump0
    Gold Bumping0
    Indium Bumping0
    Indium Bumps0
    Known Good Packaging0
    Pillar Bumps0
    Sn Bumping0
    Sn Bumps0
    Solder Bumps0
    Tape Automated Bonding0
    Tin Bumps0
    Tin Lead Bumps0
    Wafer Electroplating0
    Wafer Level Processing0

    www.imi-corp.com - 2009-02-06

  10. Pac Tech - Pac Tech - Home

    Joomla! - dynamische Portal-Engine und Content-Management-System
    Equipment4
    Packaging3
    Semiconductor2
    Solder1
    Backend1
    Flip Chip1
    Wafer Bumping1
    Wafer Level1
    Pac Tech1
    WLCSP1

    pactech.com - 2009-04-11

packaging3 pcb2 flip chip1 bags3 csp1 solder1 boxes3 flux1 lead2 bga1 plastic3

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